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Soft Thermally Conductive Electrical Insulator Memory Modules High Temperature 1.3W/MK

Soft Thermally Conductive Electrical Insulator Memory Modules High Temperature 1.3W/MK

  • Soft Thermally Conductive Electrical Insulator Memory Modules High Temperature 1.3W/MK
  • Soft Thermally Conductive Electrical Insulator Memory Modules High Temperature 1.3W/MK
  • Soft Thermally Conductive Electrical Insulator Memory Modules High Temperature 1.3W/MK
Soft Thermally Conductive Electrical Insulator Memory Modules High Temperature 1.3W/MK
Product Details:
Place of Origin: China
Brand Name: Ziitek
Certification: UL & RoHS
Model Number: TIS800K
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Price: 0.1-10 USD/pcs
Packaging Details: 24*23*12CM
Delivery Time: 3-6 work days
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Detailed Product Description
Keyword: Best Selling Silicone Thermal Insulation Sheet Application: Memory Modules
Thermal Conductivity: 1.3W/mK Original Country: China
Name: Soft Silicone Thermal Insulation Sheet Feature: Best Selling Thermal Conductive Insulating Sheet
High Light:

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Soft Thermally Conductive Electrical Insulator

Soft Thermally Conductive Electrical Insulator Memory Modules High Temperature 1.3W/MK
 
Ziitek Electronic Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent.
 
The TIS™800K Series products is a high thermal conduction and dielectric performance insulator pad
consisting of a ceramic filled low melting point compound coated on MT Kapton film.
At 50℃, TIS™800K Series begins to soften and flow, filling the microscopic irregularities of both the
thermal solution and the integrated circuit package surface, thereby reducing thermal resistance

 

TIS800K Serice Datasheet-(E)-REV01.pdf


Feature
 
> Broad range of hardnesses available
> Highly compliant surface characteristic
with high thermal conductivity
> High thermal conductive and High dielectric strength
> Low thermal resistance with high voltage isolation
> Resistant to tears and punctures

Application
> Power conversion equipment
> Power semiconductors:
To packages, MOSFETs & IGBTs
> Audio and Video components
> Automotive control units
> Motor controllers
> General high pressure interface

 

 
Typical Properties of TISTM808K Series
 
Product Name
TISTM808K
Colour
Light amber
Composite Thickness
0.008" (0.203mm)
Specific Gravity
2.0 g/cc
Heat Capacity
1 l/g-K
Hardness
50 Shore A
Tensile Strength
>13.5 Kpsi
Continuos Use Temp
(-58 to 266℉) / (-50 to 130℃)
Dielectric Breakdown Voltage
>5000 VAC
Dielectric Constant
1.8 MHz
Volume Resistivity
3.5*1014 Ohm-meter
Fire rating
94 V0
Thermal conductivity
1.3 W/m-K

 

Standard Thicknesses:
0.004"(0102mm) 0.005"(0.127mm) 0.006"(0.152mm)
Consult the factory alternate thickness.
Standard Sizes:
10" x 100"(254mm x 30.48M)
Individual die cut shapes can be supplied.
Peressure Sensitive Adhesive:
Peressure Sensitive Adhesive is not applicable for TIS™800K series products.
Reinforcement:
TIS800K series sheets are Kapton® reinforced.

Soft Thermally Conductive Electrical Insulator Memory Modules High Temperature 1.3W/MK 0
 

Why Choose us ?
 
1.Our value message is'' Do it right the First time, total quality control''.
2.Our core competencies is thermal conductive interface materials
3.Competitive advantage products.
4.Condidentiality agreement Bussiness Secrect Contract
5.Free sample offer
6.Quality assurance contract
 

Q: What's the thermal conductivity test method given on the data sheet ?
A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.
 

Contact Details
Dongguan Ziitek Electronical Material and Technology Ltd.

Contact Person: Miss. Dana

Tel: +86 18153789196

Send your inquiry directly to us (0 / 3000)

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